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梳理玻璃基板供应链关键厂商和时间线。
关于玻璃基板(glass substrate)的时间线，这里有一些非常有用的重申信息（来源：Trendforce）： - SKC Absolics(011790)：2026年下半年，先发者，联合 $AMAT，客户包括 $AMD。 - Samsung Electro-Mechanics(009150)：2027年下半年，联合住友化学(4005)，面向 Apple / $AVGO / 超大云厂商。 至于 $INTC 2030 年，我不太确定。
原推 ↗英文原文
Just very helpful timelines reiterated around glass substrate (source: Trendforce): - SKC Absolics (011790) H2 2026 (first mover x $AMAT) - $AMD customers - Samsung electromechanics h2 2027 (009150) x Sumitomo Chem (4005) - Apple / $AVGO / hyperscalers Idk about $INTC 2030 https://t.co/zI7nD2YQpa
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长文阐述XFAB作为欧洲CPO硅光子代工的潜在重估机会。
好吧……周末再随便想一些关于 $XFAB 的东西。 我仍然觉得它可能成为下一个 $TSEM，只是现在还处在早期阶段，市值约14亿美元？ 他们有点跳过了当前一代技术（$TSEM 正在从中获得出货量），转而竞争2027年下半年 CPO 放量拐点。$ASX 文件提到 Xfab（也就是 photonixFAB）专注于 CPO。 他们正在搭建某种像黑魔法一样的 MTP（转移印刷）激光架构，并结合 TFLN 等其他东西。 基本上这是下一代集成 IP。当然，他们的良率仍然落后。 但 $NVDA 正在评估它用于收发器/交换机，看它能否实现批量爬坡。而 $NOK 负责制定这些交换机/网络设备的规格和组装（顺便说一句，英伟达也投资了诺基亚，和这些交换机/网络有关）。 如果他们的 MTP 供应链跑通，比如 Smart Photonics 提供激光器、欧洲厂商负责组装，那么它基本上会随着 $NVDA 一起放量，就像 Nvidia 当初为什么和 $TSEM 签长期协议一样。 下行风险呢？ 它已经低于重置账面价值，当然还能更低，但通常会有一个限度。 未来几个月也许会有更多 CHIPS Act 2 补贴。如果 CPO 不顺利，还有 SiC（同比增长152%，SiC 晶圆出货同比增长195%）和 GaN 功率半导体的上行空间。 欧洲人或大模型会说：“哦，评估并不代表未来合同！” 但这次有点不同，因为欧盟站在这项努力背后，$XFAB 也涉及主权光子供应链。 这不是典型的公司与超大云厂商评估，因为 $NVDA 也想对欧洲监管者保持友好。如果英伟达只留在美国/台湾/中国，欧洲大概会很生气。 所以，如果他们能把这种 MTP 黑魔法做成并实现量产，几乎可以确定 Nvidia/Nokia 会让这家小小的14亿美元硅光子代工厂参与放量，至少也会给他们一些较小合同。 从时间线看，也许只是早了几个月，因为放量在2027年下半年/2028年上半年，这刚好和 CPO 扩产时间线一致。 也可能只是市场还没搞懂，因为他们把项目命名成 photonixfab 这种奇怪名字？ 如果叫 XFAB Photonics 可能会更好，让机构和筛选器在寻找 CPO 硅光子代工厂时更容易把点连起来。 汽车业务中期也应该走出低谷，并受自动驾驶加速。台积电董事长昨天评论称，AI 汽车和机器人一样是台积电的增长向量。所以它的核心业务中期也应该重新加速。 显然，市场和欧洲投资者想看到的是“英伟达签署20亿美元以上合同，XFab 2027年放量！” 但到那时，它就会是一家90亿美元以上的公司，你也就错过所有上行空间了。尤其是现在分析师和机构对这些放量预期几乎是盲的。 我通常不投资仍在评估阶段的公司，但这次看起来受到欧盟主权和政府支持显著去风险；如果 IP 做得出来，还有 Nvidia 和 Nokia 带来出货量。 我认为市场很可能漏掉了什么……它作为欧洲 CPO 敞口的长期上行价值，几乎还没有被定价。
原推 ↗英文原文
Okay... just some more weekend shower thoughts about $XFAB. I still feel like it could be the next $TSEM, just early stage at a $1.4B MC? They kinda leapfrogged current gens (which $TSEM are getting volume from) to compete for H2 2027 CPO scale up inflection point ($ASX docs cite Xfab (aka. photonixFAB) as focusing on CPO) By building out some black magic MTP (transfer printing) architecture for lasers w/ other stuff like TFLN. Basically next-gen integration IP, they're still behind on yields, sure. But $NVDA evaluating it for transceivers/switches to see if it can volume ramp. That $NOK sets the specifications/assembly for. (nvidia invested in nokia for this these switches/networking too btw). And if their MTP supply chain works... (eg. with Smartphotonics providing lasers, EU players doing assembly). It basically volume ramps with $NVDA just like why Nvidia signed long term agreements with $TSEM? Downside risk? Already below replacement book value, can always go lower yeah, but typically to a certain point. Maybe more CHIPS act subsidies next few months from chips act 2. If it doesn't go well there's SiC (152% Y/Y Growth, 195% Y/Y SiC wafer shipment growth)/GaN power semi upside. Europeans /LLMs will say "oh evaluations doesn't mean it's a future contract!". This is kinda different since the European Union is behind this effort and $XFAB for soverign photonic supply chains. Not your typical company + hyperscaler evaluation, since $NVDA wants to be nice to Europe's regulators. They'd prob be pissed if nvidia just stayed in US/Taiwan/China. So if they can make this MTP black magic work with mass production, feels almost for sure nvidia/nokia volume ramp on some tiny $1.4B silicon photonics foundry or at least throw them a bone with smaller contracts. In terms of timelines, maybe just a months early since it volume ramps H2 2027/H1 2028 (which happens to be in line with CPO scale up timelines)... Or just unknown because they named their project something stupid like photonixfab? Like XFAB Photonics would have been better? so institutions/screeners can connect the dots when looking at CPO silicon photonic foundry players? Automotive should also coming out of a slump medium term, sped up by self-driving (TSM Chairmain comments yesterday said ai automotive was TSM's growth vector alongside robotics). So their core business also should pick up speed too medium term. Obviously markets/europeans want a "Nvidia signs $2B+ contract, XFab volume ramping 2027!" But by then it will be a $9B+ company and you miss out on all the upside. And especially since everyone analyst/institution is blind to volume expectations for these.... Normally don't invest in companies in evaluation stages, but this just seems very de-risked by EU sovereignty + Gov backing, and you have Nvidia + Nokia there for volumes if they can make the IP work. I think markets are probably missing something here... there's almost 0 value being assigned to being CPO exposure in Europe as their long term upside.
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把总统的持仓风格比作 FinX 网红
为什么我们总统的股票交易风格像个 FinX 网红……一路做多半导体供应链，从 $JBL 到 $AMAT？ 看起来更像是一只自制 ETF，而不是在挑单只 long。 如果他也买 $CRBS，我完全不会意外，哈哈。 如果你好奇，这里是前 100 个多头仓位。
原推 ↗英文原文
Why is our president stock trading like a FinX influencer... Going long on semi supply chains like $JBL to $AMAT? Looks more like a self-made ETF rather than picking individual longs tbh. Not surprised if he picks up $CRBS too lol. Here were the top 100 long positions if you were curious.
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说明 AMAT 太大，没什么直接暴露
$AMAT 是一家 3400 亿美元市值的公司，你不会获得太多直接暴露。
原推 ↗英文原文
@StockStormX $AMAT is a $340B company, you're not getting much direct exposure to it.
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分析CPO供应链中三家最有可能实现3倍涨幅的公司：SIVE(MC约$1.3B)、MSSCORP($1.2B)、Auros($210M)。
至于3倍涨幅的股票，在这些水平上我认为： 1. SIVE 2. MSSCORP (6830) 3. Auros (322310) 是我最看好的猜测。以下是我的思路： 1. SIVE：我真心认为他们明年能达到100亿美元以上的市值，他们是CPO激光器领域的绝对前沿，与LITE和COHR并列。 按130亿美元市值计算...关于可能的版图映射： 光子学领域：AMD CPO、MRVL Celestial CPO、JBL 1.6T、Lightmatter、Ayar、ALChip、GUC、O-Net (ELS)、POET。 太空与国防领域：通过YSS、RTX、ERIC、Bae Systems实现的Golden Dome项目。 硅光子学领域：AAPL（Apple Watch）。 这已经是非常多的客户了，而且还在持续增加。 他们总是可以通过IP收购向下游拓展TAM，或垂直整合来快速追赶LITE的600亿美元市值，一旦获得更多融资的话。 2. MSSCORP (6830)：CPO检测领域的垄断者，约12亿美元市值。 对CPO良率的100%垄断，TSM、AMAT、NVDA、LCRX、INTC等很可能都是客户。 "公司的目标是占据CPO检测市场90%的份额" 这基本意味着100%，只是他们不想引发反垄断担忧。如果他们守住垄断地位且CPO产能增加，很容易从12亿美元涨到50-90亿美元。 3. Auros (322310)：三星/SK海力士的供应商，约2.1亿美元市值，专注于混合键合(Hybrid Bonding)量测。 基本上专注于两类产品： -> HBM4 / HBM4e / HBM5周期，这是KLA此前在IR量测领域拥有垄断地位的市场。 ---> 目前正在三星工厂进行认证，下半年预计量能爬坡。SK海力士在升级到混合键合时很可能也会进行认证。 -> 薄膜厚度测量。 ---> 正在获得"主要本土芯片制造商"（三星或SK海力士之一）的认证，目标今年实现批量供应。 他们已经开发了十多年，终于要在下半年从数年的认证期转向两类产品的量能爬坡。 如果他们转型到量能爬坡阶段，似乎非常有希望在3倍至6.3亿美元左右，这在韩国市场中像是一颗未被发现的宝石。 当然，我不确定这些公司最终会如何发展，这全都是推测性的，但这是高置信度的供应链映射。 但凭我的直觉，这三只我自己持有的股票在这个水平上最有可能。
原推 ↗英文原文
As for 3x brrrs these levels: 1. $SIVE 2. MSSCORP (6830) 3. Auros (322310) Are my best guesses. Here's my thought process: 1. $SIVE: I genuinely do see them being $10B+ next year, they're the literal bleeding edge for CPO lasers alongside $LITE and $COHR. At a $1.3B MC... For likely mapping: Photonics: $AMD CPO, $MRVL Celestial CPO, $JBL 1.6T, Lightmatter, Ayar, ALChip, GUC, O-Net (ELS), $POET. For Space + Defense: Golden Dome via $YSS, $RTX / $ERIC / Bae Systems. Silicon Photonics: $AAPL (Apple Watches). This is just a stupid amount of customers and it's still increasing. They can always TAM expansion downstream through IP acquisitions or vertically integrate to speedrun $LITE's $60B MC one day once they get more funding. 2. MSSCORP (6830): CPO monopoly over inspection at ~$1.2B. 100% monopoly over CPO yields, $TSM, $AMAT, $NVDA, $LCRX, $INTC, and others are all likely customers. "The company’s goal is to seize a 90 percent share of the CPO inspection market" This basically means 100%, they just don't want antitrust. If they defend their monopoly and CPO ramps, can easily see this worth ~$5B-$9B from $1.2B 3. Auros (322310): Samsung / SK Hynix supplier at ~$210M for Hybrid Bonding Metrology. Basically pure play on two products: -> HBM4 / HBM4e / HBM5 cycles, that $KLA had a monoply over for IR metrology. ---> Getting qualified now likely in Samsung factories, H2 volume ramp est. Sk Hynix likely qualifying too when they upgrade to hybrid bonding. -> Thin-film thickness measurement. ---> Getting qualified now, with "major domestic chipmaker" (either Samsung/Sk hynix), targets mass supply this year. They've been developing for the past decade, only to volume ramp two products from years of qualification H2 this year. Seems extremely likely to 3x to $630M if they switch to volume ramp, feels like an undiscovered gem in the Korean market? Of course, not sure how they play out and this is all speculative but high confidence supply chain mapping. But off the top of my head these three that I own are the most likely ones at this level.
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MSSCorps 在 CPO 检测上像垄断
我现在做多 MSSCorps（6830），市值大约 14 亿美元。 这看起来像是 CPO 检测环节的功能性垄断。 但市场可能把它和材料/失效分析混淆了，后者更像 MA-tek 和 iST 那样的寡头格局。 按客户映射来看： 1. $TSM 2. $NVDA 3. $AAPL 4. $AMAT 5. $LRCX 6. $ASML 7. $INTC 还有很大概率包括 $AVGO、联发科、三星、$MRVL 等等（他们也提到了欧盟）。 如果你感兴趣： - 台北时报把 TSM 说成是客户，Msscorps 为其提供先进材料和失效分析，还点名了苹果、英伟达、Lam、AMAT（也感谢 Latent 和我一起做尽调。英伟达那边还有通过 LinkedIn 之类看到的其他供应链关系） - 对 $AMSL 而言，《台北时报》在 2024 年 9 月 10 日写到：“ASML 采用了 Msscorps 超高灵敏度的光刻胶材料分析” - 对英特尔来说，材料分析实验室 MSSCORPS 已经拿下了英伟达和英特尔等大厂的订单（工业技术研究院） 至于检测（非破坏性红外漏检），他们几乎是垄断。 而且他们还积极使用诉讼（比如 Enli Tech 诉讼）来挡住竞争对手，我把这看成正面因素。 这带来了巨大的定价权和收益率，而且每个主要玩家都要经过他们。 CPO 检测市场也极其关键，和 $AXTI 在 InP 基板环节一样，这种巨大卡点具有纯粹的定价权和提价能力。 风险在于专利诉讼不一定按计划推进，但英伟达和其他超大规模云厂商大概率不会在 MSSCorps 赢了之后去找别家，因为他们不想承担风险。 所以这本身就构成了一个多年期的巨大优势。 超大规模云厂商不会等一个新兴竞争对手证明自己能赢再行动，也不会愿意承担这个风险。 我确实看到了 MSSCorps 因为在 CPO 的关键良率卡点上有机会重估，所以我选择做多（非投资建议，自己做功课），这就是我的思路。
原推 ↗英文原文
I am now long MSSCorps (6830) ~$1.4B MC This appears to be a functional monopoly in CPO for inspection. But markets might have conflated that with Material/Failure Analysis with MA-tek and iST (oligopoly). For customers from mapping: 1. $TSM 2. $NVDA 3. $AAPL 4. $AMAT 5. $LRCX 6. $ASML 7. $INTC And high probability $AVGO, MediaTek, Samsung, $MRVL, and others (they did mention EU too). If you're curious: - Taipei times names TSM as a client that Msscorps provides them with advanced material and failure analysis and name drops Apple, Nvidia, Lam, AMAT (also S/O to Latent for doing DD with me on this. there's other supply chain relationships to Nvidia through things like linkedin) - For $AMSL, Taipei Times, Sept 10, 2024 "ASML adopted Msscorps' ultra-sensitive materials analysis of photoresists" For Intel - Material analysis lab MSSCORPS has secured orders from major manufacturers such as Nvidia and Intel (Industrial Technology Research). For inspection (non-destructive infrared (IR) leakage detection), they're a monopoly. And have aggressively used litigation (like the Enli Tech lawsuit) to lock out rivals, which I view as a positive thing. This creates massive pricing power with yields and every major player goes through them. CPO inspection market is also extremely critical and like $AXTI in the InP substrate section, this massive chokepoint has pure pricing power with price hikes. The risk is the patent suit doesn't go as plan, but Nvidia and other hyperscalers aren't likely to go with other parties in case MSSCorps wins, so this creates a massive multi-year advantage anyway. Hyperscalers aren't going to wait to see how an emerging competitor is going to win or not + take the risk. I do see the massive re-rating potential with MSSCorp holding a critical yields chokepoint over CPO, so I went long (NFA, DYOR), this is just my thought process.
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AI 相关供应链全面拥堵
最近新闻和瓶颈的 TLDR，全部都在起飞： 1. CPU 瓶颈 - $INTC CEO 说 AI 推理把 CPU 比例从 1:8 推到了 1:1。 CPU 起飞（$AMD、Intel、$ARM）-> $AMAT / $TSM / $KLAC 等也跟着起飞。 2. PGME / PGMEA 短缺。DuPont、Shiny Chemical、Daxin、San Fu、$DOW 等都要起飞？ 光刻胶瓶颈也起飞？ 3. 微控制器潜在瓶颈 + 涨价（Arterytek / Arterychip）正在压缩 AI 产能。 MCU 公司可能也要起飞？ 4. 总统本周援引了《国防生产法》，里面包括： - 变压器 - 输电组件 - 先进导体 - 电力电子 - 变电站 - 高压断路器 - 保护继电器、 电容组 - 电气硅钢 这些都被称为“严重短缺”。像 $AMSC、$PLPC、$POWL、$VICR、$ATKR、$HPS.A 之类的也要起飞。 5. $GOOGL 在扩容新的 TPU 服务器。谷歌把 AI 芯片拆成训练 TPU 和推理 TPU。 台湾很开心。联发科等也要起飞？ 6. 三星、Kingston 把 SSD 价格上调了 10% 以上。 SSD 价格还会继续起飞？ 7. T-玻璃玻纤短缺还在恶化？Nittobo 等也继续起飞？ 8. 用于蚀刻电路和阻燃的关键材料溴，价格已经涨到每公吨 12,000 美元。 以色列的 ICL Group 似乎掌控了全球 40% 的供应？ 我对这个不算特别熟，但也有点可疑的起飞？ 9. “外延厂 Landmark Optoelectronics 报告称产量仍远低于客户需求”。 嗯 $IQE 和其他公司也要起飞？ 10. “AI 数据中心碰到互连限制，正在推高光模块需求”。“瓶颈不再只是算力，而是算力如何连接。” 来自 $AAOI、$LITE、$COHR、Innolight 等的光子链条继续起飞？下一代来自 $SIVE、$POET、$MRVL、Win Semi 等也起飞？ 基本上就是 AI 半导体供应链全面起飞，因为 AI 超大规模云厂商需求带来了到处都是的短缺。
原推 ↗英文原文
TLDR of recent news + bottlenecks that go brr: 1. CPU bottleneck - $INTC CEO said AI inference pushed CPU Ratio From 1:8 to 1:1. CPUs go brr ( $AMD, Intel, $ARM) -> $AMAT / $TSM / $KLAC, etc. go brr. 2. PGME / PGMEA shortage. DuPont, Shiny Chemical, Daxin, San Fu, $DOW and others go brr? Photoresist bottleneck go brr? 3. Microcontroller potential bottleneck + price hikes (Arterytek/Arterychip) was weighing price hikes on AI capacity squeezes. MCU companies potentially go brr? 4. President invoked the "Defense Production Act" this week, it included: -Transformers - transmission components - advanced conductors - power electronics - substations - high-voltage circuit breakers - protective relays, capacitor banks - electrical core steel As "severe shortages". Stuff like $AMSC, $PLPC, $POWL, $VICR, $ATKR, $HPS.A go brr. 5. $GOOGL ramps new TPU servers. Google splits AI chips into training and inference TPUs. Taiwan happy. Mediatek and others go brr? 6. Samsung, Kingston lift SSD prices by over 10%. SSD prices keep going brrr? 7. T-glass fiberglass shortages keep getting worse? Nittobo and others keep going brrr? 8. Bromine, essential for etching circuits and flame retardancy, has surged to $12,000 per metric ton. ICL Group in Israel apparently controls 40% of the global supply? Not as familiar with this but questionable brrr? 9. "Epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer needs". Uhh $IQE and others go brr? 10. "AI data centers hit interconnect limits, boosting optical module demand". "the bottleneck is no longer computing power alone, but how that power is connected." Photonics from $AAOI, $LITE, $COHR, Innolight and others keep going brr? next gen from $SIVE, $POET, $MRVL, Win Semi and others go brr? Basically AI semi supply chains go brr because there's widespread shortages everywhere due to AI hyperscaler demand.
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AMD 之外的主要受益者
@northyvt 我觉得除了 $AMD 之外，$TSM 和 OSAT / 先进封装合作伙伴会是主要受益者？ 也许 $AMAT、$LRCX、$KLAC、$ASML 以及其他公司也会受益？ $INTC 也有他们最近回购回来的自有工厂，所以也挺开心的。
原推 ↗英文原文
@northyvt I feel like $TSM and OSAT/advanced packaging partners are the main beneficiaries apart from $AMD? Maybe like $AMAT, $LRCX, $KLAC, $ASML and others too? $INTC also have their own fabs that they bought back recently so it's happy.
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BESI被纳入瓶颈标的，混合键合技术验证供应链重要性，但涨幅预期有限。
$BESIY / $BESI 在我的非正式瓶颈ETF里！不过我还需要补上 $LRCX、$AMAT 和 BESI 的新闻。这确实验证了混合键合(hybrid bonding)对先进封装的重要性。所以仅基于供应链重要性，就是很好的做多标的。但真不觉得它会像上面的其他股票那样涨300%，比如 $AAOI。
原推 ↗英文原文
$BESIY / $BESI was in my informal bottleneck ETF! Still need to catch up to the $LRCX, $AMAT and BESI news though. Does definitely validate how important hybrid bonding is to advanced packaging. So good long just based on supply chain importance. But don't really see it going up 300% like other names above like $AAOI.
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梳理SiC中介层供应链瓶颈及2027年Rubin架构落地时间线。
如果你不喜欢 $WOLF，以下是 $NVDA Rubin 和超大规模客户 ASIC 潜在的碳化硅(SiC)中介层瓶颈股组合： 下游 SiC： $TSM - 用于 CoWoS 中介层的 SiC $AMKR - 用于 SiC 集成的 S-SWIFT 封装 $ASX - VIPack 平台及光学集成 中游 SiC： $KLAC - SiC 缺陷检测 $ONTO - 面板级封装+检测 $AMAT - SiC 沉积 $AEHR - SiC 检测 $ENTG - 化学机械抛光(CMP) $BESI (AS) - 混合键合设备 Disco - 70-80% 市场份额的精密切割 SiC 晶圆： $WOLF - 300mm SiC 晶圆 $COHR - 150mm 和 200mm SiC，仍在开发中 SK Siltron CSS (KRX: 034730) - 建设至 200mm Resonac (4004 TYSE) - SmartSiC 键合 NGK Insulators - 晶体生长 Kyocera - SiC 及陶瓷封装 这些都是早期供应链+活跃研究标的。 那么时间线何时到来？ 2025-2026 (Blackwell Ultra)：继续依赖硅中介层 2027 (Rubin / Rubin Ultra)：在最高端 AI SKU 中引入 SiC 中介层。 2028+：玻璃基板/SiC/金刚石中介层？ 披露：我持有上述 $AMKR, $AEHR, $ONTO, $COHR 和 $TSM。
原推 ↗英文原文
The potential SiC (Silicon Carbide) Interposer bottleneck stack for $NVDA Rubin and Hyperscaler ASICs (if you didn't like $WOLF): Downstream SiC: $TSM - SiC for CoWoS interposers $AMKR - S-SWIFT packaging for SiC integration $ASX- VIPack platform and optical integration. SiC Midstream: $KLAC - SiC defect inspection $ONTO - Panel-level packaging + inspection $AMAT - SiC deposition $AEHR - SiC inspection $ENTG - CMP $BESI (AS) - Hybrid Bonding equipment Disco - 70-80% marketshare precision cutting SiC Wafers: $WOLF - 300mm SiC wafers. $COHR - 150mm and 200mm SiC, still developing SK Siltron CSS (KRX: 034730) - Building to 200mm Resonac (4004 TYSE) - SmartSiC bonding NGK Insulators - Crystal growth Kyocera - SiC and ceramic packaging These are all early supply chain + active research. So when does this timeline hit? 2025-2026 (Blackwell Ultra): Continued reliance on Silicon Interposers 2027 (Rubin / Rubin Ultra): Introduction of SiC interposers in the highest-end AI SKUs. 2028+: Glass Substrates/SiC/Diamond Interposers? Disclosure: I own $AMKR, $AEHR, $ONTO, $COHR and $TSM above.