$KLAC
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列出被点名的玻璃基板龙头链条
如果你感兴趣，这里是被点名的“领先”玻璃基板玩家： • $LPK —— TGV Equipment • $GLW —— 玻璃材料 • $ASGLY（5201 T）—— 玻璃材料 • $NIDGY（5214 T）—— 玻璃材料 • $LRCX —— 刻蚀设备 • $DSCSY（6146 T）—— 切割设备 • $SMHSF —— 键合系统 • $ONTO —— 检测工具 • $KLAC —— 检测工具 很有意思，像我年初就提到过的 LPK，当时市值只有大约 1.5 亿美元，如今却被 Trendforce 等机构点名成了关键玩家。
英文原文
“Leading” Glass Substrate players that were name dropped if you’re curious: • $LPK — TGV Equipment • $GLW — Glass Materials • $ASGLY (5201 T)— Glass Materials • $NIDGY (5214 T) — Glass Materials • $LRCX — Etching Systems • $DSCSY (6146 T)— Dicing Equipment • $SMHSF — Bonding Systems • $ONTO — Inspection Tools • $KLAC — Inspection Tools Fun to see the stuff I’ve called out early in the year like LPK at ~$150m MC get mentioned as a critical player by Trendforce and others.
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AI 相关供应链全面拥堵
最近新闻和瓶颈的 TLDR，全部都在起飞： 1. CPU 瓶颈 - $INTC CEO 说 AI 推理把 CPU 比例从 1:8 推到了 1:1。 CPU 起飞（$AMD、Intel、$ARM）-> $AMAT / $TSM / $KLAC 等也跟着起飞。 2. PGME / PGMEA 短缺。DuPont、Shiny Chemical、Daxin、San Fu、$DOW 等都要起飞？ 光刻胶瓶颈也起飞？ 3. 微控制器潜在瓶颈 + 涨价（Arterytek / Arterychip）正在压缩 AI 产能。 MCU 公司可能也要起飞？ 4. 总统本周援引了《国防生产法》，里面包括： - 变压器 - 输电组件 - 先进导体 - 电力电子 - 变电站 - 高压断路器 - 保护继电器、 电容组 - 电气硅钢 这些都被称为“严重短缺”。像 $AMSC、$PLPC、$POWL、$VICR、$ATKR、$HPS.A 之类的也要起飞。 5. $GOOGL 在扩容新的 TPU 服务器。谷歌把 AI 芯片拆成训练 TPU 和推理 TPU。 台湾很开心。联发科等也要起飞？ 6. 三星、Kingston 把 SSD 价格上调了 10% 以上。 SSD 价格还会继续起飞？ 7. T-玻璃玻纤短缺还在恶化？Nittobo 等也继续起飞？ 8. 用于蚀刻电路和阻燃的关键材料溴，价格已经涨到每公吨 12,000 美元。 以色列的 ICL Group 似乎掌控了全球 40% 的供应？ 我对这个不算特别熟，但也有点可疑的起飞？ 9. “外延厂 Landmark Optoelectronics 报告称产量仍远低于客户需求”。 嗯 $IQE 和其他公司也要起飞？ 10. “AI 数据中心碰到互连限制，正在推高光模块需求”。“瓶颈不再只是算力，而是算力如何连接。” 来自 $AAOI、$LITE、$COHR、Innolight 等的光子链条继续起飞？下一代来自 $SIVE、$POET、$MRVL、Win Semi 等也起飞？ 基本上就是 AI 半导体供应链全面起飞，因为 AI 超大规模云厂商需求带来了到处都是的短缺。
英文原文
TLDR of recent news + bottlenecks that go brr: 1. CPU bottleneck - $INTC CEO said AI inference pushed CPU Ratio From 1:8 to 1:1. CPUs go brr ( $AMD, Intel, $ARM) -> $AMAT / $TSM / $KLAC, etc. go brr. 2. PGME / PGMEA shortage. DuPont, Shiny Chemical, Daxin, San Fu, $DOW and others go brr? Photoresist bottleneck go brr? 3. Microcontroller potential bottleneck + price hikes (Arterytek/Arterychip) was weighing price hikes on AI capacity squeezes. MCU companies potentially go brr? 4. President invoked the "Defense Production Act" this week, it included: -Transformers - transmission components - advanced conductors - power electronics - substations - high-voltage circuit breakers - protective relays, capacitor banks - electrical core steel As "severe shortages". Stuff like $AMSC, $PLPC, $POWL, $VICR, $ATKR, $HPS.A go brr. 5. $GOOGL ramps new TPU servers. Google splits AI chips into training and inference TPUs. Taiwan happy. Mediatek and others go brr? 6. Samsung, Kingston lift SSD prices by over 10%. SSD prices keep going brrr? 7. T-glass fiberglass shortages keep getting worse? Nittobo and others keep going brrr? 8. Bromine, essential for etching circuits and flame retardancy, has surged to $12,000 per metric ton. ICL Group in Israel apparently controls 40% of the global supply? Not as familiar with this but questionable brrr? 9. "Epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer needs". Uhh $IQE and others go brr? 10. "AI data centers hit interconnect limits, boosting optical module demand". "the bottleneck is no longer computing power alone, but how that power is connected." Photonics from $AAOI, $LITE, $COHR, Innolight and others keep going brr? next gen from $SIVE, $POET, $MRVL, Win Semi and others go brr? Basically AI semi supply chains go brr because there's widespread shortages everywhere due to AI hyperscaler demand.
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AMD 之外的主要受益者
@northyvt 我觉得除了 $AMD 之外，$TSM 和 OSAT / 先进封装合作伙伴会是主要受益者？ 也许 $AMAT、$LRCX、$KLAC、$ASML 以及其他公司也会受益？ $INTC 也有他们最近回购回来的自有工厂，所以也挺开心的。
英文原文
@northyvt I feel like $TSM and OSAT/advanced packaging partners are the main beneficiaries apart from $AMD? Maybe like $AMAT, $LRCX, $KLAC, $ASML and others too? $INTC also have their own fabs that they bought back recently so it's happy.
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供应链瓶颈等权重组合周涨12.83%，全红表现惊人。
基于供应链映射的“瓶颈ETF”。 没有一只股票是红色的（下跌）。 等权重组合1周收益：+12.83%。 名单： $LITE: +31.68% $AMKR: +28.7% Disco: +24.35% $GLW: +23.57% $COHR: +23.5% $ONTO: +18.4% $CAMT: +17.7% $TSM: +15.8% $ON: +15.8% Samsung: +15.4% $KLAC: +12.7% $APH: +11.6% $MRVL: +11.4% $MU: +10.6% $MOD: +10.6% Sk Hynix: +10.31% $VICR: +9.6% $AVGO: +9.46% $SBGSY: +9.27% $ETN: +9.1% $BESIY: +8.53% $IFNNY: +7.37% $MPWR: +6.85% $SNDK: +6.4% $QLCM: +6.12% $AMD: +6.01% Mediatek: +6% Kioxia: +3.68% $INTC: +1.62% 我觉得机构是不是直接把上周框架里的这份名单全买了？ 这种表现水平简直太疯狂了。
英文原文
The "Bottleneck ETF" from supply chain mapping. Not a single name red. Equal weighted results 1W: +12.83%. List: $LITE: +31.68% $AMKR: +28.7% Disco: +24.35% $GLW: +23.57% $COHR: +23.5% $ONTO: +18.4% $CAMT: +17.7% $TSM: +15.8% $ON: +15.8% Samsung: +15.4% $KLAC: +12.7% $APH: +11.6% $MRVL: +11.4% $MU: +10.6% $MOD: +10.6% Sk Hynix: +10.31% $VICR: +9.6% $AVGO: +9.46% $SBGSY: +9.27% $ETN: +9.1% $BESIY: +8.53% $IFNNY: +7.37% $MPWR: +6.85% $SNDK: +6.4% $QLCM: +6.12% $AMD: +6.01% Mediatek: +6% Kioxia: +3.68% $INTC: +1.62% I feel like institutions just bought this entire list from last week's framework? This level of performance is pretty crazy.
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梳理AI半导体供应链瓶颈，看好存储、光子及台积电，指出中游为定价关键。
以下是我对 Semivision 瓶颈总结的 TLDR（太长不看版）及其映射到投资框架的内容： HBM（高带宽内存）： HBM4 (16Hi) - 三星，SK 海力士，$MU HBF（高带宽闪存）- $SNDK，Kioxia Base Die（基础晶圆）- $TSM，三星（内部） CPO（共封装光学）/光子学： 玻璃基板：$GLW，$INTC，Ibiden 光学：$LITE，$AVGO，$COHR，$MRVL 电力传输： 电压：$MPWR，$VICR 散热：$VRT，$NVT，$MOD 电网：$ETN，$SBGSY SiC/GaN（碳化硅/氮化镓）：$ON，$IFNNY 机架：$APH N2 产能： $TSM，$AMD（数据中心先行者），$QLCM，联发科，$NVDA 先进封装： 良率：$CAMT，$ONTO，$KLAC OSATs（外包半导体组装与测试）：$AMKR $BESIY，Disco Semivision 的总结： 1. “先进封装产能与良率控制” 2. “HBM 生态系统协调” 3. “电力传输创新（SiC、GaN PMICs、机架级电源架构）” 4. “CPO/光子学集成能力” 5. “数据中心基础设施作为半导体收入实现的‘隐性限制因素’” 正如你可能知道的，我对上述的存储/光子学领域（如 SK 海力士/三星，$SNDK，$MU，$LITE）以及 $TSM 最为看好。 我可能会稍微向上游延伸，比如 $AXTI（磷化铟前驱体），但中游玩家是瓶颈所在，并掌控大部分定价权。 但为了简化普通散户投资者的理解，我添加了相关公司的评论。
英文原文
Here's my TLDR + mapped into investment framework from Semivision bottleneck summary: HBM: HBM4 (16Hi) - Samsung, Sk Hynix, $MU HBF - $SNDK, Kioxia Base Die - $TSM, Samsung (internal) CPO/photonics; Glass Substrate: $GLW, $INTC, Ibiden Optical: $LITE, $AVGO, $COHR, $MRVL Power Delivery: Volatage: $MPWR, $VICR Thermal: $VRT, $NVT, $MOD Grid: $ETN, $SBGSY SiC/GaN: $ON, $IFNNY Rack: $APH N2 Volume: $TSM , $AMD (First mover dc), $QLCM, Mediatek, $NVDA Advanced Packaging: Yield: $CAMT, $ONTO, $KLAC OSATs: $AMKR $BESIY, Disco Semivision's summary: 1. "advanced packaging capacity and yield control" 2. "HBM ecosystem coordination" 3. "power delivery innovation (SiC, GaN PMICs, rack-level power architectures)" 4. "CPO/photonics integration capability" 5. "data center infrastructure as a “hidden limiter” to semiconductor revenue realization" As you probably know, I'm probably most bullish on memory/photonics like Sk Hynix/Samsung, $SNDK, $MU, $LITE above. And $TSM. I probably go a bit more upstream like $AXTI for InP precursors, but midstream players are the chokepoint + control most of the pricing. But just added commentary of related companies to topics to make things simpler for the regular retail investor.
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梳理SiC中介层供应链瓶颈及2027年Rubin架构落地时间线。
如果你不喜欢 $WOLF，以下是 $NVDA Rubin 和超大规模客户 ASIC 潜在的碳化硅(SiC)中介层瓶颈股组合： 下游 SiC： $TSM - 用于 CoWoS 中介层的 SiC $AMKR - 用于 SiC 集成的 S-SWIFT 封装 $ASX - VIPack 平台及光学集成 中游 SiC： $KLAC - SiC 缺陷检测 $ONTO - 面板级封装+检测 $AMAT - SiC 沉积 $AEHR - SiC 检测 $ENTG - 化学机械抛光(CMP) $BESI (AS) - 混合键合设备 Disco - 70-80% 市场份额的精密切割 SiC 晶圆： $WOLF - 300mm SiC 晶圆 $COHR - 150mm 和 200mm SiC，仍在开发中 SK Siltron CSS (KRX: 034730) - 建设至 200mm Resonac (4004 TYSE) - SmartSiC 键合 NGK Insulators - 晶体生长 Kyocera - SiC 及陶瓷封装 这些都是早期供应链+活跃研究标的。 那么时间线何时到来？ 2025-2026 (Blackwell Ultra)：继续依赖硅中介层 2027 (Rubin / Rubin Ultra)：在最高端 AI SKU 中引入 SiC 中介层。 2028+：玻璃基板/SiC/金刚石中介层？ 披露：我持有上述 $AMKR, $AEHR, $ONTO, $COHR 和 $TSM。
英文原文
The potential SiC (Silicon Carbide) Interposer bottleneck stack for $NVDA Rubin and Hyperscaler ASICs (if you didn't like $WOLF): Downstream SiC: $TSM - SiC for CoWoS interposers $AMKR - S-SWIFT packaging for SiC integration $ASX- VIPack platform and optical integration. SiC Midstream: $KLAC - SiC defect inspection $ONTO - Panel-level packaging + inspection $AMAT - SiC deposition $AEHR - SiC inspection $ENTG - CMP $BESI (AS) - Hybrid Bonding equipment Disco - 70-80% marketshare precision cutting SiC Wafers: $WOLF - 300mm SiC wafers. $COHR - 150mm and 200mm SiC, still developing SK Siltron CSS (KRX: 034730) - Building to 200mm Resonac (4004 TYSE) - SmartSiC bonding NGK Insulators - Crystal growth Kyocera - SiC and ceramic packaging These are all early supply chain + active research. So when does this timeline hit? 2025-2026 (Blackwell Ultra): Continued reliance on Silicon Interposers 2027 (Rubin / Rubin Ultra): Introduction of SiC interposers in the highest-end AI SKUs. 2028+: Glass Substrates/SiC/Diamond Interposers? Disclosure: I own $AMKR, $AEHR, $ONTO, $COHR and $TSM above.
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梳理受益于美光及三星的HBM4供应链中小市值美股标的。
存储超级周期供应链要点： 受益于 $MU 和 SK/三星的美国冷门 HBM4/存储阿尔法标的： $VECO ($20亿) - 激光退火 $PLAB ($21亿) - 光刻掩模版 $ADEA ($21.8亿) - 混合键合 $ACLS ($29亿) - 离子注入 $FORM ($64.3亿) - HBM晶圆测试 $ONTO ($106亿) - 封装量测 $AMKR ($131亿) - 先进封装 $RMBS ($135.5亿) - 存储IP $MKSI ($149亿) - 激光子系统 未包含 $TER 和 $KLAC 等巨头，只想聚焦于知名度较低的标的。 还有一些间接受益者如 $SMTC 和 $MTSI。市场肯定尚未完全定价其中部分标的。 如果我漏掉了任何标的请告诉我。 只是想发布这些，以防你们对其中任何一只感兴趣。
英文原文
Memory Supercycle Supply Chain TLDR: US Sleeper HBM4/Memory alpha picks that benefit from $MU and SK/Samsung: $VECO ($2B) -Laser annealing $PLAB ($2.1B) - Lithography photomask $ADEA ($2.18B) - Hybrid bonding $ACLS ($2.9B) - Ion implantation $FORM ($6.43B) - HBM wafer testing $ONTO ($10.6B) - Packaging metrology $AMKR ($13.1B) -Advanced packaging $RMBS ($13.55B) - Memory IP $MKSI ($14.9B) - Laser subsystems Didn't include big players like $TER and $KLAC since just wanted to focus on lesser known ones. There's some indirect beneficiaries too like $SMTC and $MTSI. Markets definitely haven't priced some of these in yet. Let me know if I missed any. Just wanted to publish these in case you find any of them interesting.