$BESIY
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BESI被纳入瓶颈标的，混合键合技术验证供应链重要性，但涨幅预期有限。
$BESIY / $BESI 在我的非正式瓶颈ETF里！不过我还需要补上 $LRCX、$AMAT 和 BESI 的新闻。这确实验证了混合键合(hybrid bonding)对先进封装的重要性。所以仅基于供应链重要性，就是很好的做多标的。但真不觉得它会像上面的其他股票那样涨300%，比如 $AAOI。
英文原文
$BESIY / $BESI was in my informal bottleneck ETF! Still need to catch up to the $LRCX, $AMAT and BESI news though. Does definitely validate how important hybrid bonding is to advanced packaging. So good long just based on supply chain importance. But don't really see it going up 300% like other names above like $AAOI.
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供应链瓶颈等权重组合周涨12.83%，全红表现惊人。
基于供应链映射的“瓶颈ETF”。 没有一只股票是红色的（下跌）。 等权重组合1周收益：+12.83%。 名单： $LITE: +31.68% $AMKR: +28.7% Disco: +24.35% $GLW: +23.57% $COHR: +23.5% $ONTO: +18.4% $CAMT: +17.7% $TSM: +15.8% $ON: +15.8% Samsung: +15.4% $KLAC: +12.7% $APH: +11.6% $MRVL: +11.4% $MU: +10.6% $MOD: +10.6% Sk Hynix: +10.31% $VICR: +9.6% $AVGO: +9.46% $SBGSY: +9.27% $ETN: +9.1% $BESIY: +8.53% $IFNNY: +7.37% $MPWR: +6.85% $SNDK: +6.4% $QLCM: +6.12% $AMD: +6.01% Mediatek: +6% Kioxia: +3.68% $INTC: +1.62% 我觉得机构是不是直接把上周框架里的这份名单全买了？ 这种表现水平简直太疯狂了。
英文原文
The "Bottleneck ETF" from supply chain mapping. Not a single name red. Equal weighted results 1W: +12.83%. List: $LITE: +31.68% $AMKR: +28.7% Disco: +24.35% $GLW: +23.57% $COHR: +23.5% $ONTO: +18.4% $CAMT: +17.7% $TSM: +15.8% $ON: +15.8% Samsung: +15.4% $KLAC: +12.7% $APH: +11.6% $MRVL: +11.4% $MU: +10.6% $MOD: +10.6% Sk Hynix: +10.31% $VICR: +9.6% $AVGO: +9.46% $SBGSY: +9.27% $ETN: +9.1% $BESIY: +8.53% $IFNNY: +7.37% $MPWR: +6.85% $SNDK: +6.4% $QLCM: +6.12% $AMD: +6.01% Mediatek: +6% Kioxia: +3.68% $INTC: +1.62% I feel like institutions just bought this entire list from last week's framework? This level of performance is pretty crazy.
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梳理AI半导体供应链瓶颈，看好存储、光子及台积电，指出中游为定价关键。
以下是我对 Semivision 瓶颈总结的 TLDR（太长不看版）及其映射到投资框架的内容： HBM（高带宽内存）： HBM4 (16Hi) - 三星，SK 海力士，$MU HBF（高带宽闪存）- $SNDK，Kioxia Base Die（基础晶圆）- $TSM，三星（内部） CPO（共封装光学）/光子学： 玻璃基板：$GLW，$INTC，Ibiden 光学：$LITE，$AVGO，$COHR，$MRVL 电力传输： 电压：$MPWR，$VICR 散热：$VRT，$NVT，$MOD 电网：$ETN，$SBGSY SiC/GaN（碳化硅/氮化镓）：$ON，$IFNNY 机架：$APH N2 产能： $TSM，$AMD（数据中心先行者），$QLCM，联发科，$NVDA 先进封装： 良率：$CAMT，$ONTO，$KLAC OSATs（外包半导体组装与测试）：$AMKR $BESIY，Disco Semivision 的总结： 1. “先进封装产能与良率控制” 2. “HBM 生态系统协调” 3. “电力传输创新（SiC、GaN PMICs、机架级电源架构）” 4. “CPO/光子学集成能力” 5. “数据中心基础设施作为半导体收入实现的‘隐性限制因素’” 正如你可能知道的，我对上述的存储/光子学领域（如 SK 海力士/三星，$SNDK，$MU，$LITE）以及 $TSM 最为看好。 我可能会稍微向上游延伸，比如 $AXTI（磷化铟前驱体），但中游玩家是瓶颈所在，并掌控大部分定价权。 但为了简化普通散户投资者的理解，我添加了相关公司的评论。
英文原文
Here's my TLDR + mapped into investment framework from Semivision bottleneck summary: HBM: HBM4 (16Hi) - Samsung, Sk Hynix, $MU HBF - $SNDK, Kioxia Base Die - $TSM, Samsung (internal) CPO/photonics; Glass Substrate: $GLW, $INTC, Ibiden Optical: $LITE, $AVGO, $COHR, $MRVL Power Delivery: Volatage: $MPWR, $VICR Thermal: $VRT, $NVT, $MOD Grid: $ETN, $SBGSY SiC/GaN: $ON, $IFNNY Rack: $APH N2 Volume: $TSM , $AMD (First mover dc), $QLCM, Mediatek, $NVDA Advanced Packaging: Yield: $CAMT, $ONTO, $KLAC OSATs: $AMKR $BESIY, Disco Semivision's summary: 1. "advanced packaging capacity and yield control" 2. "HBM ecosystem coordination" 3. "power delivery innovation (SiC, GaN PMICs, rack-level power architectures)" 4. "CPO/photonics integration capability" 5. "data center infrastructure as a “hidden limiter” to semiconductor revenue realization" As you probably know, I'm probably most bullish on memory/photonics like Sk Hynix/Samsung, $SNDK, $MU, $LITE above. And $TSM. I probably go a bit more upstream like $AXTI for InP precursors, but midstream players are the chokepoint + control most of the pricing. But just added commentary of related companies to topics to make things simpler for the regular retail investor.