北京时间 2026-09-01 16:30:14 · 供应链分析

梳理AI供应链瓶颈：内存、ABF、CPO及地缘政治动态。

涉及标的： $AAPL $AMD $AMZN $AVGO $AXTI $CAPA $CXMT $GOOGL $INTC $MRVL $NVDA $SKHY $SOI $SPCX $STM

中文翻译

一些我感兴趣的TLDR新闻摘要： 1. $GOOGL（漏看了）也联合$NVDA投资了联发科，参与其39亿美元融资。Google/Nvidia在投资眼光上真是“山羊”（顶级），从$SPCX到Anthropic都是如此。 2. 三星电机披露了7.789亿美元的MLCC（多层陶瓷电容器）订单；$CAPA（新MLCC ETF）也为无法访问韩/日/台市场的投资者提供了敞口。但关键在于，每个加速器所需的MLCC数量增加，可能预示着未来比人们预期更极端的瓶颈。 3. 中国渠道调查显示：行星滚柱丝杠、6D力传感器和灵巧手难以实现国产替代。其中行星滚柱丝杠的国产替代率最低。例如$SHA0.DE做行星滚柱丝杠。只是听听护城河挺有意思。 4. 据报道，三星约70%的内存产能已锁定至2031年/商品DRAM也陷入短缺 - 首尔经济日报。TrendForce预计2026年Q3服务器DRAM合约价环比上涨13-18%。SK海力士也公开表示内存短缺将持续至2030年。 5. $CXMT已开始小批量生产HBM3E，并据称实现了LPDDR6的大规模量产。这对传统DRAM短缺的暗示更为积极。 6. 思科在台湾SEMICON表示共封装光学(CPO)已准备好大规模部署；可插拔模块仍将是市场主流。$MRVL也表示客户正积极规划早在2027年扩大光学部署。 7. 闻泰科技 -> 收购安世半导体 -> 荷兰政府实际上剥夺了闻泰的控制权 -> 闻泰正通过中国法院反击。但安世3亿美元资产被冻结。当然还有更多地缘政治戏剧，总是很娱乐。$AAPL也明确指控OpenAI销毁关键证据...（更多乐子） 8. 关于SOI（绝缘体上硅）衬底$SOI的ASP（平均售价）上涨描述不多，但他们现在有10+客户参与LTA（长期协议），$2亿营收被称为“底线”，评论称客户更关心获得晶圆而非制造地。所以基本上随着硅光子技术在2027年起飞，现在进入产能预留阶段。 9. 一些渠道调查显示高功率MOSFET和大面积TVS二极管的交货期高达~52周。（$STM据报道也在8月23日实施了2026年第三次涨价） 10. 传统封装产能可能在2027年面临超过20%的缺口，“引线键合设备”成为主要瓶颈，本周早些时候已覆盖过，受益者如... 11. 声称所有六大ABF供应商2026年订单已满，交货期12-14个月，部分供应商拍卖剩余产能；$NVDA、$AMD和超大规模客户锁定ABF产能至2028年，并推动供应商规划2029-30年扩产。像Kinsus (3189)、Unimicron (3037)、南亚PCB (8046)、Ibiden (4062)等名字大概都很开心。 12. CCL（覆铜板）主导的层压板产品再次涨价10%-20%，今年第7次涨价（如建滔）。行业估计HVLP4铜箔短缺在2026年约48%/2027年43%，而Low-Dk/T-Glass交货期已延长至30周以上。 13. “(GaAs)衬底材料和砷化镓外延源材料在2026年第三季度也面临新一轮涨价，据报道比限制初期高出5到6倍。”“中国最近放宽了一些衬底出口管制”，但据digitimes称“InP衬底严重短缺”。只是些$AXTI相关更新。 14. $AMD和$AVGO据报道预订了PowerTech计划的大部分FOPLP产能，早于2027年中大规模量产。 15. $INTC考虑使用$INTC代工生产HBM4E基底芯片。但$SKHY直接回应称“部分内容与事实不符”。 16. “OpenAI囤积数万台$AAPL Mac mini和Mac Studio”用于强化学习。Anthropic也从$AMZN租赁Mac mini单元。Tim Cook退休有点可惜，但老哥表现确实“山羊”（顶级）。只是些随机有趣的笔记。

英文原文

Just some TLDR news I found interesting: 1. $GOOGL (missed this) also invested in Mediatek alongside $NVDA for their $3.9B raise. Google/Nvidia are goats with investments you look at $SPCX to Anthropic. 2. Samsung Electro-Mechanics discloses $778.9M MLCC deal / $CAPA (new MLCC ETF) also gives exposure now for folks without Korea/Japan/Taiwan market access. But thing is more accelerators x MLCCs per accelerator might indicate a more future extreme bottleneck than people expect. 3. China channel checks state: planetary roller screws, 6D force sensors, and dexterous hands resist domestic substitution. Then planetary roller screw as the top with lowest domestic substitution rate. eg. $SHA0.DE for planetary. Just interesting to hear moats I guess. 4. Samsung reportedly has ~70% of memory production capacity committed through 2031 / commodity DRAM has also fallen into short supply - Seoul Economic Daily. TrendForce expects server DRAM contract prices to rise 13-18% QoQ in 3Q26 SK Hynix also publicly stated the memory shortage lasts through 2030. 5. $CXMT has begun producing HBM3E in small quantities and reportedly claimed mass production of LPDDR6. Implications are even more positive for legacy DRAM shortages. 6. Cisco at SEMICON Taiwan said CPO is ready for mass deployment; pluggable modules will remain the market mainstay. $MRVL also said customers are actively planning scale-up optics deployments as early as 2027 7. Wingtech -> bought Nexperia -> Netherlands effectively removed Wingtech’s control -> Wingtech is fighting back through Chinese courts. But Nexperia got $300m of their assets frozen. More geopolitical drama of course, always entertaining. $AAPl also explicitly accused OpenAI of destroying crucial evidence... (for more fun) 8. Not much description around ASP hikes regarding SOI substrates $SOI, but they now have 10+ customers involved with LTAs, $200m revenue described as a "floor", comments about customers more concerned about obtaining wafers than where they are manufactured. So basically moving into capacity reservation now stages as silicon photonics takes off in 2027. 9. Some channel checks put lead times for high power MOSFETs and large area TVS diodes as high as ~52 weeks. ($STM also reportedly implemented its 3rd 2026 price increase on August 23) 10. Traditional packaging capacity could face a deficit exceeding 20% by 2027" with "wire bonding equipment" emerging as the primary bottleneck", covered this earlier this week with beneficiaries like 11. Claims that all six major ABF suppliers are booked for 2026, with 12-14 month lead times and some suppliers auctioning remaining capacity; $NVDA, $AMD and hyperscalers locking ABF capacity through 2028 and pushing suppliers to plan 2029–30 expansions. Names like Kinsus (3189), Unimicron (3037), Nan Ya PCB (8046), Ibiden (4062), etc are all probably happy. 12. CCL leading laminated board products increased by another 10%-20%, 7th price hike this year (eg. Kingboard). Industry estimates put the HVLP4 copper-foil shortage at ~48% in 2026 / 43% in 2027, while Low-Dk/T-Glass lead times have stretched beyond 30 weeks. 13. "(GaAs) substrate materials and gallium epitaxial source materials are also facing another round of price increases in the third quarter of 2026, reportedly 5 to 6 times higher than at the early stage of the restrictions." "China has recently eased some substrate export controls" but there's a "severe InP substrate shortage" per digitimes. Just some $AXTI related updates 14. $AMD and $AVGO reportedly booked most of Powertech's planned FOPLP capacity ahead of mid-2027 mass production 15. $INTC considering $INTC foundry for HBM4E base dies. But $SKHY responded directly that "some of the content is different from the facts". 16. "OpenAI Hoarding Tens Of Thousands Of $AAPL Mac mini and Mac Studio" for reinforcement learning. Anthropic has been renting mac mini units from $AMZN as well. Kinda sad Tim Cook retired, but dude had a goated run. Just random interesting notes

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