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博主祝贺粉丝里程碑，分享个人关注书签比率的偏好。
@Gubloinvestor 恭喜，这是一个里程碑！很高兴我在过去4周获得了2600万次曝光。 我个人最关注书签比率，因为这意味着人们觉得我的帖子值得收藏。 你的成长速度太快了！ https://t.co/7snSgendL5
英文原文
@Gubloinvestor Congrats, what a milestone! Im happy i got 26M impressions in the last 4 weeks. I personally track bookmark ratios the most because it means people find my posts memorable. You’re growing so fast! https://t.co/7snSgendL5
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半导体级AlSiC供应链格局及非AI领域应用现状
这里我只讨论材料，本贴不涉及具体公司。 但从供应链角度来看，半导体级铝硅碳化物(AlSiC)的粗略市场份额估算如下： CPS - 30.1%（美国） Denka (TYO: 4061) - 18.7%（日本） Japan Fine Ceramics - 15.6%（日本） MC-21 - 12.1%（美国） BYD - 11.4%（中国） 有趣的是，BYD将其用于电动汽车，而CPS用于国防到高速铁路，因此目前的散热应用非常广泛（尚未涉及AI领域）。
英文原文
I'm just talking about materials here, nothing about specific companies in this post. But in terms of the supply chain, rough est. of semi grade AlSiC looks like this: CPS - 30.1% (United States) Denka (TYO: 4061) - 18.7% (Japan) Japan Fine Ceramics - 15.6% (Japan) MC-21 - 12.1% (United States) BYD - 11.4% (China) It's interesting because BYD use it for EVs while CPS uses it for defense to high speed rails so just all over the board thermal applications usage so far (aside from AI yet).
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博主计划深入研究增强型硅-28技术。
@MarkosAAIG 我需要深入研究一下增强型硅-28(enhanced Si-28)。我敢肯定那些量子圈(quants)的家伙们对此了如指掌。
英文原文
@MarkosAAIG I need to do more research into enhanced Si-28. I'm sure the quantum bros know all about it
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高性能计算或成碳化硅铝继航空航天后的新应用领域。
@__Tomster 没错！高性能计算(HPC)看起来是碳化硅铝(AlSiC)在航空航天/工业之后的下一个潜在行业应用领域。https://t.co/Io4vj1Qms1
英文原文
@__Tomster Yep! HPC looks like a possible next sector application for AlSiC after aerospace/industrial. https://t.co/Io4vj1Qms1
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2027-28年GPU散热瓶颈或致AlSiC材料替代铜铝。
散热可能是2027-2028年GPU的一个问题： 随着散热目标向2000-3000W+范围攀升，铜和铝变得不足。 但AlSiC（铝硅碳化物），一种金属基复合材料，可能变得重要。 原因如下： Rubin VR200 GPU指向1800W TDP，AMD Instinct MI450X据报道高达2500W，$NVDA Rubin Ultra的功耗据报道达到2300W。 向2300W的转变创造了大规模的热通量问题。 AlSiC（铝硅碳化物）是一种金属基复合材料，用于国防、太空和高功率工业应用（如高铁）。 就像Toto等随机马桶公司成为HBM关键一样，这种用于航空航天和工业散热的材料复合材料可能会被用于AI，因为它可以在不发生分层的情况下承受数万次热循环。 因此，随着Rubin等AI加速器达到与工业电源模块或太空相当的功率水平，半导体中AlSiC的采用可能变得重要。 对于2300W系统中的AlSiC： - （结到壳）：包括硅芯片、底部填充物和第一层TIM（热界面材料） - （壳到散热器）：包括均热板（顶盖）和第二层TIM（TIM2） - （散热器到环境）：冷板或液体换热器的热阻。 壳到散热器可能是AlSiC的应用场景。 随着功率密度可能继续向3000W攀升，可能会出现机械和散热危机，这可能导致材料从传统铜封装发生变化。 所以这里有四个部分： 1. 内部/外部散热 看起来SiC（碳化硅）中介层（内部）可能用于$NVDA Rubin代GPU。然后AlSiC（外部）可能用于微通道顶盖（MLCP）或位于芯片中介层组件上方的均热板。 2. 3D垂直堆叠（SoIC） 这些复杂的封装在热循环期间极易翘曲。SiC中介层是脆性晶体，无法提供结构刚性。AlSiC充当“加强筋”，防止基板在高夹紧压力下弯曲。 3. Rubin Ultra NVL576机架可能达到高千瓦功率密度 这种密度造成了SiC中介层无法解决的重量负载瓶颈。Rubin Ultra NVL576机架散热堆栈加液体流道的累积重量可能超过地板承重限制（AlSiC可能成为必要，以在不牺牲传热性能的情况下将散热管理的“死重”减少60%以上）。 4. 微通道的净成型制造 传统铜顶盖必须蚀刻或CNC加工，据报道这一过程在Rubin量产中遇到了高难度。 AlSiC使用“快速注射成型”制造陶瓷预成型体，然后渗入铝。这允许创建复杂的内部几何形状。AlSiC微通道顶盖和硅集成IHS看起来是铜散热管理的替代品。 我们可能会在2026年初看到这一问题的解决，因为SemiAnalysis在2025年报道Nvidia的Blackwell（B100/B200）因CoWoS-L封装中的翘曲问题面临良率问题。 TLDR散热可能是2027-2028年的瓶颈： 一些潜在受益者可能是SiC中介层（高纯度SiC粉末）和用于2027-2028年散热的AlSiC复合材料。 这都是持续的研究，但也许我们会在1-2年内看到一些极其小众且随机的铁路或太空AlSiC供应商被AI使用，就像HBM的马桶制造商一样。
英文原文
Thermal is a likely issue for 2027-2028 GPUs: As thermal targets escalate toward the 2000-3000W+ range, copper and aluminum becomes insufficient. But, AlSiC, a metal matrix composite, may become important. Here's why: Rubin VR200 GPU pointed toward 1800W TDP, AMD Instinct MI450X, reportedly reaches up to 2500W, and $NVDA Rubin Ultra's power reportedtly goes to 2300W. The move toward 2300W creates a heat flux problem of massive scale. Aluminum Silicon Carbide (AlSiC) is a metal matrix composite, used as for defense, space, and high-power industrial applications (eg. high-speed rail). Similar to how random toilet companies like Toto became critical for HBM, this material composite used for thermal management for aerospace and industrial might be used for AI as it can survive tens of thousands of thermal cycles without delamination. So, as AI accelerators like Rubin reach power levels comparable to industrial power modules or space, the adoption of AlSiC in semiconductors may become important. For AlSiC in 2300W systems there's: - (Junction-to-Case): Includes the silicon die, the underfill, and the first layer of TIM - (Case-to-Sink): Includes the heat spreader (lid) and the second layer of TIM (TIM2) - (Sink-to-Ambient): The thermal resistance of the cold plate or liquid heat exchanger. Case-to-Sink is likely the application for AlSiC. And as power densities will likely continue to climb toward the 3000W mark there becomes a mechanical and thermal crisis that likely causes a material change from traditional copper packaging. So there's four different parts to this: 1. Internal/External Thermal It does look like SiC interposers (internal) are probably used for $NVDA Rubin gen GPUs. Then AlSiC (external) may be used for the Microchannel Lid (MLCP) or heat spreader that sits on top of the die interposer assembly. 2. 3D vertical stacking (SoIC) These complex packages are highly vulnerable to warping during thermal cycling. A SiC interposer is a brittle crystal and it cannot provide structural rigidity. AlSiC acts as a "stiffener" that prevents the substrate from bowing under the high clamping pressures 3. Rubin Ultra NVL576 rack likely reaches high KW of power density This density creates a weight-loading bottleneck that SiC interposers cannot solve. Rubin Ultra NVL576 rack cumulative weight of the thermal stack plus liquid manifolds can exceed the floor limits (and AlSiC may become necessary to reduce the "dead weight" of the thermal management by 60%+ without compromising heat transfer). 4. Net-Shape Manufacturing of Microchannels Traditional copper lids must be etched or CNC-machined, a process that has reportedly encountered high mass-production difficulty for Rubin volumes. AlSiC is manufactured using "Quickset Injection Molding" to create a ceramic preform that is then infiltrated with aluminum. This allows for the creation of complex internal geometries. AlSiC Microchannel Lids and Silicon Integrated IHS looks like the alternatives for copper for thermal management. We might be seeing this addressed earlier in 2026 as SemiAnalysis in 2025 reported that Nvidia’s Blackwell (B100/B200) faced yield issues specifically due to warpage in the CoWoS-L packaging. TLDR thermal is a likely a bottleneck in 2027-2028: Some beneficiaries are potentially SiC interposers (high-purity SiC powder) and AlSiC composite for thermal management in 2027-2028. This is all ongoing research, but maybe we'll see some extremely niche and random small railway or space AlSiC supplier be used up for AI in 1-2 years time like toilet makers for HBM.
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关注VICR的GPU供电技术，预判机构正布局下一代架构瓶颈。
@PhotonCap 我得好好研究一下 $VICR。直接在 GPU 裸片(die)下方供电这一点真的很有趣！ 虽然 2027 年的下一代架构可能会出现许多新的瓶颈，但我确信许多投资机构已经在研究并抢先布局了。
英文原文
@PhotonCap $VICR 을 한번 살펴봐야겠네요. GPU 다이(die) 바로 아래에서 전력을 공급한다는 점이 정말 흥미롭습니다! 2027년 차세대 아키텍처에서는 수많은 새로운 병목 현상들이 발생할 수 있겠지만, 이미 많은 투자사들이 이를 연구하며 선점에 나서고 있을 것이라 확신합니다.
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指出COHR市值超300亿，并分享潜在供应链瓶颈清单。
@JakeWoods143114 $COHR 是一家市值超 300 亿美元的公司。这是一份关于潜在瓶颈/卡脖子环节（bottleneck/chokepoints）的低调清单。不过这确实是一家很棒的公司。
英文原文
@JakeWoods143114 $COHR is a $30B+ company. This was a list of under-the-radar potential bottleneck/chokepoints. Great company though.
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某公司掌控全球超两成半导体材料供应，或成2027年散热瓶颈受益者。
这里有一家有趣的公司，恰好拥有全球约 25-30% 的半导体级材料供应链。散热可能是一个问题，因此随着 $NVDA 架构在 2027 年的部署，这可能成为一个潜在的材料复合材料瓶颈。H200（<1000W）没有问题，但随着 Rubin 部署功率升至 2000W，它可能是材料转型的隐性受益者。
英文原文
There's an interesting company on here that happens to own ~25-30% of this semi-grade material supply chain in the world. Thermal is probably an issue, so might be a potential material composite chokepoint with $NVDA architectures in 2027. There was no issue with H200s (<1000W) but as you get higher to 2000w with Rubin deployments, might be a hidden beneficiary of material transitions.
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分析$BAER高负债导致自由现金流被锁定用于偿债。
我研究了 $BAER。正如你提到的，需要注意的有：2.029亿美元+的债务，4.003亿美元+的优先股负债（需计提利息），以及新的3.315亿美元融资方案。此外，你还需要在模型中计入每年约2400万美元+的债务利息，这会大幅削减自由现金流(FCF)。因此，保守估计自由现金流约为1300万-1900万美元。鉴于有2亿美元+的高级债务和4亿美元+的优先股，这1900万美元的自由现金流基本被“锁定”，用于偿还债务。话虽如此，这些只是我复核过的资产负债表计算，我尚未深入研究公司的业务（如果其盈利能力足够强，或许能随时间推移抵消负债影响）。
英文原文
I looked into $BAER. Something to look out for as you mentioned is that there's $202.9M+ debt, and $400.3 Million + preferred stock liabilities (which accrues interest), and that new $331.5 Million financing package. Then you need to model in that there's ~$24M+ debt interest a year, which does cut into any FCF a ton. So conservative FCF would be ~$13-19M or so, that ~$200M+ in senior debt and $400M+ in preferreds, that $19M in FCF is basically "trapped" and is being used to pay off debt. That being said these are just the balance sheet calculations that I double checked, I haven't looked much into what the company is doing (maybe it would overshadow liabilities over time if they're that profitable )
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博主表示重仓英特尔和Meta，关注后续表现。
@Neomeldir 不错！我个人重仓了 $INTC 和 $META，好奇看看这两只股票在接下来的几周表现如何。
英文原文
@Neomeldir Nice! I personally loaded up on $INTC and $META, curious to see how those two do in the upcoming weeks.
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高股息股暴跌警示：安全感源于成长股而非停滞的股息。
$UNH 刚刚暴跌 -19.48% 至 $283.31。股息投资者(Dividend investors)和巴菲特跟单者(Buffet copytraders)今年过得并不轻松。来自 $PYPL 的跌幅为 -37.8%（1年），$FISV 跌幅为 -72%（1年）。这是一个残酷的警钟：通过追逐 $UNH 约 2.85% 的“股息”或进行价值投资，单日 20% 的下跌（如今天）实际上抹去了 6.6 年的等待。安全感并非来自停滞和股息，而是来自像 $NVDA、$META 或 $TSM 这样最明显的成长型公司。
英文原文
$UNH has just crashed -19.48% to $283.31. Dividend investors and Buffet copytraders are not having a fun time this year. Others from $PYPL are down -37.8% 1Y with $FISV down -72% 1Y. This is a brutal wake-up call that by chasing a ~2.85% "dividends" with UNH or value investing, a single-day drop of 20% (like today) effectively wipes 6.6 years of waiting. Safety isn't found in stagnation and dividends. It's found in the most obvious growth companies like $NVDA, $META, or $TSM.
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韩美关税升级致三星SK海力士陷入不确定性循环
特朗普将关税从15%提高到25%，专门因为韩国尚未批准去年10月的“历史性贸易协议”。正如你提到的，主要目标是“汽车、汽车零部件、木材和制药”。他的帖子提到了“所有其他互惠关税”，这可能为其他所有商品创造了一个“兜底”场景。特朗普几乎每两周就会发出威胁。这紧随霍华德·卢特尼克（Howard Lutnick）在16日（亚洲时间17日）对内存产品发出的100%关税最后通牒。韩国表示尚未收到关于关税的正式通知。这仅仅表明三星/SK海力士陷入了“TACO”循环，不太确定实际会发生什么。
英文原文
Trump raised tariffs from 15% to 25% specifically because the SK hasn't ratified the "Historic Trade Agreement" from last Oct. Primary targets as you mentioned was "automobiles, auto parts, lumber, and pharma. His post mentioned "all other Reciprocal TARIFFS," which possibly creates a "catch-all" scenario for everything else. Trump issues threats almost every other week. And this is just following Howard Lutnick's 100% tariff ultimatum on memory products on the 16th (Asia 17th). South Korea has said it has not yet received formal notification that the tariffs. This is just showing Samsung/SK Hynix are stuck in the "TACO" loop, not quite sure what will actually happen.
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看好美光因关税豁免和补贴优势，优于面临地缘压力的韩系厂商。
$MU 看起来是个很棒的做多标的！话虽如此，三星电子和 SK 海力士仍然是我最喜欢的持仓。看起来美国基本上是在利用强烈的关税威胁，迫使三星和 SK 海力士将下一代晶圆厂迁至美国本土（正如得克萨斯州 370 亿美元的三星工厂和印第安纳州 39 亿美元的 SK 海力士工厂所示）。但最近的新闻看起来像是关税逆风下的“TACO”局面（即关税行动取消操作）。相比之下，$MU 享有关税豁免 + 获得《芯片法案》补贴，且不会每天面临来自特朗普的地缘政治威胁。
英文原文
$MU looks like a great long! This being said Samsung Electronics and Sk Hynix are still two of my favorite positions. It looks like the US is essentially using strong tariff threats to force Samsung and SK Hynix to move their next generation of fabs to US soil (as seen with $37B Samsung plant in Texas and SK Hynix’s $3.9B Indiana). But recent news does look like a TACO situation with tariff headwinds. Whereas $MU is tariff-exempt + gets CHIPS Act subsidies, and doesn't have constant geopolitical threats from Trump every day.
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研究Google TPU v8x玻璃基板供应链瓶颈及潜在受益股。
我持有 $MU 的头寸，但目前只是持有不动。 说到 $INTC，我刚刚研究了关于 Google TPU v8x 据报道使用的 EMIB-T 玻璃可能存在的铝硅酸盐玻璃瓶颈： 例如：钡和锶 -> $SOLV 锡 / 二氧化锡 (SnO2) -> $MTL 化学机械抛光 (CMP) 浆料和纯度过滤器 -> $ENTG 精炼硼酸盐 -> $FEAM 气相二氧化硅 -> $CBT 还没研究完，但他们在该领域的工作确实是一个令人兴奋的机会。
英文原文
I have $MU positions but I'm just sitting on them. Speaking of $INTC, was just looking into possible aluminosilicate glass bottlenecks with EMIB-T on glass reportedly used by Google TPU v8x: eg. Barium & Strontium -> $SOLV Tin / SnO2 -> $MTL CMP Slurries and Purity Filters -> $ENTG Refined Borates -> $FEAM Fumed Silica -> $CBT Haven't finished yet, but their work in the area is definitely an exciting opportunity
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美光凭借美国制造护城河及存储超级周期，估值优于同业。
“美国制造”是美光($MU)和英特尔($INTC)拥有的最强大护城河(Moat)。 以下是美光的最新动态： 继25日NAND和DRAM涨价预期上调后： $MU的前向市盈率(Forward P/E)可能在~8.2-8.5倍左右，同时毛利率(Gross Margins)维持在75-77%。 随后是特朗普和卢特尼克的新评论： - “任何想建设存储芯片的企业只有两个选择：要么支付100%的关税，要么在美国本土建厂”——卢特尼克（在美光存储芯片工厂，1月17日） - “特朗普将对韩国进口商品关税提高至25%”——（1月27日） 这是一个非常有趣的动态，因为美光作为美国的冠军企业，仍能通过海外扩张获得税收优惠。而三星或SK海力士的类似扩张则被视为面临关税风险。 此外，今天的新消息显示美光正在新加坡以240亿美元的投资加速NAND生产。 所以大家都在问，为什么$MU的估值高于其他存储芯片制造商？ 我们正亲眼目睹美国“美国制造”护城河与“存储超级周期(Memory Supercycle)”中无休止的涨价改善利润表共同发挥作用。 白宫正在尽其所能确保其本土领导者取得成功。
英文原文
"Made in America" is the greatest moat $MU and $INTC have. Here's the recent developments with Micron: From NAND + DRAM hike est. on the 25th: $MU forward P/E would likely be ~8.2-8.5 with gross margins sitting at 75-77%. This is followed by new comments from Trump and Lutnick: - “Everyone who wants to build memory has two choices: They can pay a 100 per cent tariff, or they can build in America" - Lutnick (Micron Technology memory chip plant, Jan 17) - "Trump raises US tariffs on South Korea imports to 25%" - (Jan 27th) It's a fascinating dynamic as Micron still gets tax benefits through overseas expansion as America's champion. Whereas similar expansions by Samsung or SK Hynix are viewed through the lens of tariff risk. This is coupled with new news today that Micron was ramping up NAND production in Singapore with $24B. So everyone was wondering, why $MU was valued higher than other memory makers? We're seeing the the USA "Made in America" moat live in action together with "The Memory Supercycle" of endless price hikes improving bottom lines. The White House is doing everything it can to make its domestic leaders succeed.
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推荐关键材料ETF $REMX，认为其板块敞口良好。
@estcstfreedom $REXM 是一个不错的关键材料 ETF。我还没有仔细查看上述个股的持仓权重，但我相信它对板块的敞口（Exposure）非常好。
英文原文
@estcstfreedom $REMX is a good critical materials ETF. I haven’t looked at the portfolio weightings of the names above but I’m sure it’s great exposures to the sector
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钨在芯片、HBM及国防中关键，重要性将随锑等金属上升。
@halldj00 钨(Wolfram)相当有趣，因为它被用于芯片制造（例如 $NVDA Blackwell）、高带宽内存(HBM)、电池以及弹药等国防领域。它们之所以关键是有原因的，像锑(Antimony)这类材料曾出现过巨大的价格逼空，但我确信它们的重要性都会上升。
英文原文
@halldj00 Tungsten is pretty interesting since it's used for chip manufacturing (eg. $NVDA blackwell), hbm, batteries, and defense like ammunition. They're all critical for a reason, stuff like antimony had a huge price squeeze but I'm sure they'll all rise in importance.
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稀土板块受消息刺激盘前大涨后回落，疑似利好出尽。
@u_wol_cos 受 $USAR 消息影响，$MP、$LPTH、$UAMY、$NB 等板块在盘前大幅上涨，但随后全线下跌 8-15% 以上。看来这是针对隔夜或盘前买入的散户的“利好出尽”（Sell the news）事件？不太确定。https://t.co/Pi2mAQ6zjg
英文原文
@u_wol_cos The sector from $MP, $LPTH, $UAMY, $NB and others rose a ton premarket on the $USAR news and now they're all down 8-15%+. Guess this is a sell the news event for retail who bought in overnight/premarket? Not sure. https://t.co/Pi2mAQ6zjg
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分析 $USAR 盘前暴涨、稀释风险及 $26 入场点。
我还没来得及完全理清交易结构，当时我在看 $USAR 的盘前走势，记得它一度涨到了 +55%？ 我注意到以 $21.5 的行权价存在大量稀释，不过我不担心美国政府（持股成本约 $17.17），因为他们不会卖出。现在 $26 的入场点看起来好多了！
英文原文
I didn't have time through the deal structure fully yet, I was watching $USAR pre-market and I think it hit +55% at one point? I did see that there was a lot of dilution with a strike at $21.5, not worried about US Gov at ~$17.17 since they're not selling. Entry point at $26 looks a lot better now though!
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关注$AREC作为关键矿物精炼商在多主题下的投资价值。
@ThematicTrader $AREC 看起来非常有意思，正如你所说，他们从钕(neodymium)、镓(gallium)、锗(germanium)和锂(lithium)中捕获价值。作为一家关键矿物精炼商，它是多个主题的净受益者，我需要仔细研究一下！
英文原文
@ThematicTrader $AREC seems very interesting since they capture value from neodymium, gallium, germanium, and lithium as you mentioned. It's a net beneficiary of multiple themes as a critical mineral refiner, I need to take a closer look!
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列举中国关键矿物出口管制瓶颈及西方受益股。
今天，在美国政府提供16亿美元资金后，所有目光都聚焦在铜、$SLV 和 $USAR 上。 但你有没有想过那些更隐蔽、实则更值得关注的交易标的？ 1. 钨 - $ALM 2. 铟 - $TECK 3. 铋 - TSE: $VNP 4. 碲 - $VNP 5. 钼 - $FCX 6. 锂 - $LAC 7. 锑 - $UAMY 8. 镓 - $AA 9. 锗 - $TECK 10. 石墨 - $SYAAF 这是中国关键矿物/材料出口管制的一些主要瓶颈环节及其西方受益者的列表。 并不是每天都有外国政府直接告诉你该买什么。
英文原文
Today, all eyes are on Copper, $SLV, and $USAR after US Gov's $1.6B funding. But ever wonder about the more silent trades you should really be watching out for? 1. Tungsten - $ALM 2. Indium - $TECK 3. Bismuth - TSE: $VNP 4. Tellurium - $VNP 5. Molybdenum - $FCX 6. Lithium - $LAC 7. Antimony- $UAMY 8. Gallium - $AA 9. Germanium - $TECK 10. Graphite - $SYAAF This are the list of some of the top Chinese critical minerals/material export control chokepoints and the Western beneficiary. Not everyday do you have foreign governments telling you what to buy.
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质疑IONQ被收购价格，建议SKYT股东避免持有。
@wallstengine 作为 $SKYT 的股东，我不希望以 $20 的价格持有 $IONQ。真不敢相信他们要被收购了。
英文原文
@wallstengine I would not want to hold $20 in $IONQ as a $SKYT shareholder. Can't believe they're getting bought
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博主回复粉丝祝福并回以干杯。
@retail_mourinho 你也一样！干杯 :)
英文原文
@retail_mourinho Same to you! Cheers :)
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以太坊国库公司清算资产购买波音发动机令人难以置信。
@TheRonnieVShow 第一家以太坊(Ethereum)国库公司清算了1.14亿美元的$ETH，用于购买两台波音(Boeing) CFM56-7B24航空发动机。 当我读到这些文章时，我简直不敢相信自己的眼睛。
英文原文
@TheRonnieVShow The first Ethereum treasury firm liquidated $114m of $ETH to buy two Boeing CFM56-7B24 aircraft engines. I couldn’t believe my eyes when I read these articles.
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博主感谢日本社区推荐，希望内容值得阅读。
@beauty_oe 非常感谢您推荐我！衷心感谢日本 X 社区的各位。 我满怀感激之情。希望我的帖子对各位来说值得花时间阅读。🙇🏻
英文原文
@beauty_oe ご紹介いただき、誠にありがとうございます！日本のXコミュニティの皆様には、心より感謝申し上げます。 本当に感謝の気持ちでいっぱいです。私のポストが、皆様にとって時間を割いて読む価値がある内容であることを願っています。🙇🏻
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博主感谢粉丝支持，表示账号成长离不开大家。
@beauty_oe 谢谢！账号能发展到这个规模，毫无疑问多亏了〇〇。真的非常感谢！
英文原文
@beauty_oe ありがとう！アカウントがここまで大きくなれたのは、間違いなく〇〇のおかげだよ。マジで感謝してる！
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博主感谢粉丝并回忆自己早期粉丝增长经历。
@Gubloinvestor 谢谢！很高兴看到你的账号最近增长如此迅速。这让我想起几个月前我粉丝数达到 5K 的时候。
英文原文
@Gubloinvestor Thanks! Amazing seeing your account grow so much recently. Reminds me of the time I was at 5K followers few months back
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调侃动漫虚拟主播是程序员的瓶颈
@skowihx 拥有虚拟主播(VTuber) Hololive 的 Cover Corp (5253.T)？ 动漫女孩是软件工程师已知的瓶颈。
英文原文
@skowihx Cover Corp (5253.T) that owns Hololive for VTubers? Anime girls are a known bottleneck for software engineers.
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感谢早期支持者，回顾共同成长历程。
@pepemoonboy 感谢你的善意留言！你是最早与我互动的 FinX 意见领袖之一（也是我最早关注的人之一），很高兴看到我们共同成长。
英文原文
@pepemoonboy Appreciate the kind message! You were one of the FinX influencers that first interacted with me (and one of the first people I followed) and it's fun to see our growth together.
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博主表示去年看好NAYNA但进场较晚。
@zephyr_z9 我去年也很看好 $NAYNA，但我进场已经相当晚了。
英文原文
@zephyr_z9 I liked Nayna last year too, but I am pretty late to the party