· 供应链分析

MRVL 可能自研中介层封装

涉及标的:

中文翻译

$MRVL 很可能会把那个 interposer 封装 IP 变成内部能力。我原本就预计他们会在后面把 $POET 设计出去,只是没想到这么早。 他们完全可以直接从 $LITE 或 $SIVE 这种公司买激光器,然后自己搭建整个流程。 激光设计比封装难得多。

英文原文

$MRVL will likely do that interposer packaging IP in-house. I did expect them to design out $POET down the road, just not this early. They can just buy lasers directly from someone like $LITE or $SIVE and build the process themselves. Laser design is much much harder than the packaging side of things.

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