· 供应链分析
涉及标的： $2313
Starlink / Amazon Kuiper LEO 想法： -> Compeq（2313）：“已获得包括 Starlink 和 Amazon Kuiper 计划在内的领先运营商订单” - 96亿美元市值。 “分析师称，PCB 供应商涌入可能形成‘玩家众多、蛋糕有限’动态，提高新进入者壁垒。” - Unitech Printed Circuit Board - Chin-Poon Industrial、K Tech - ACCL “都预计在赢得合同时面临越来越大困难。” 接下来会发生什么： - 光学星间链路（OISL）。 瓶颈想法： - 高频所需的下一代 HDI 板越来越依赖特殊材料，导致上游供应链交期更长。 所以值得研究这个上游领域。
Starlink / Amazon Kuiper LEO ideas: -> Compeq (2313): "has secured orders from leading operators, including Starlink and Amazon's Kuiper program" - $9.6B MC "Analysts say the influx of PCB suppliers is likely to produce a "many players, limited pie" dynamic, raising barriers for newer entrants" - Unitech Printed Circuit Board - Chin-Poon Industrial, K Tech - ACCL "are all expected to face growing difficulty in winning contracts." What's coming next: - optical inter-satellite links (OISL). Bottleneck ideas: - next-generation HDI boards required for high-frequency are increasingly dependent on specialty materials, leading to longer lead times across the upstream supply chain So good to look into this upstream area.